Korean chipmakers
Samsung to set up chip packaging R&D center in Tokyo, raise stakes vs TSMC
Samsung Electronics Co. will set up an advanced chip packaging research and development center in Yokohama, Japan with an investment of 25 billion yen ($170 million), according to semiconductor industry sources on Wednesday, intensifying its rivalry with TSMC in the high-stakes packaging market. The South Korean chipmaker expects the research lab, slated to open in March 2027, to bolster i